Self-developed eMMC flash controller chip, self-developed firmware, LDPC error correction algorithm, domestic stream chip, domestic seal test, support mainstream NAND, compatible with mainstream Host platform, high performance, high stability, low power consumption, strong compatibility.

Self-developed UFS controller chip, self-developed firmware, domestic sealed test, can support mainstream NAND, can be compatible with mainstream Host platform, high performance, high stability, low power consumption, strong compatibility

Full capacity coverage, 200ball standard package, speed up to 4266Mbps, low power consumption, widely used in smart phones, Android tablets, laptops, digital set-top boxes, smart TVS, smart hardware and other markets, strict test conditions, high reliability

Dual capacity rate upgrades for higher performance and efficiency.

Maximum support DDR3-1866Mbps, DDR4-3200Mbps, strictly tested and AVL certified by the mainstream Host platform

Compatible with JEDEC eMMC5.1 specification, support HS400 high-speed mode, self-developed eMMC flash controller, self-developed firmware, strong independent controllability, ensure system fluency and stability, 4GB-256GB full capacity coverage, good compatibility with mainstream Host platform, support multi-scenario application, meet customer needs

Equipped with self-developed UFS 2.2 controller chip, support write enhancement technology, significantly improve read and write speed Support LDPC 3.0 ECC error correction engine mechanism, effectively protect data security, capacity up to 512GB, suitable for mobile intelligent terminal products.

Using NAND and LPDDR4/4X multi-chip package, reduce system development time and PCB board area, effectively reduce signal interference, and stabilize data transmission rate

Self-developed flash memory controller chip, self-developed firmware, the controller chip, NAND and LPDDR integrated in a multi-chip package, reduce system development time and PCB board area, effectively reduce signal interference, stable data transmission rate.

Capacity covers 1GB-8GB, 200ball standard package, speed up to 4266Mbps, product selection of wafer categories, industrial/vehicle level package design and high-reliability material selection, strict screening of the production line, 100% three-temperature test, product consistency

Capacity covers 4GB-8GB, 315ball standard package, product selection of wafer categories, industrial/vehicle scale package design and high-reliability material selection, strict screening of the production line, 100% three-temperature test, product consistency

Compatible with JEDEC eMMC5.1 specifications, support HS400 high-speed mode, using self-developed eMMC flash controller, self-developed firmware, strong autonomous controllability, the main long-life high-quality product route, up to 6w PE erase times

SATA 3.2 standard, 128GB-2TB;Low power consumption, high performance, high reliability, strong compatibility

SATA 3.2 standard, 128GB-1TB;Low power consumption, high performance, high reliability, strong compatibility

SATA 3.2 standard, 128GB-2TB;Support DEVSLP, VDT, SMART, PM;Low power consumption, high performance, high reliability, strong compatibility

PCIe 3 x 4 NVME1.4;The data transmission rate reaches the theoretical interface protocol speed,with continuous read > 3400MB/S and continuous write > 2800MB/s.High compatibility, high reliability, high security and low power consumption

PCIe 4 x 4 NVMe2.0;The data transmission rate reaches the theoretical interface protocol speed,with continuous read > 7400MB/S and continuous write > 6500MB/s.High compatibility, high reliability, high security and low power consumption

Original high-quality memory particles, up to 3200MHz frequency, 1.2v low voltage operation, high performance and low power consumption

Original high-quality memory particles, up to 5600MHz frequency, 1.1v low voltage with PMIC chip, high performance and low power consumption