MCP
Using NAND and LPDDR4/4X multi-chip package, reduce system development time and PCB board area, effectively reduce signal interference, and stabilize data transmission rate.
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Product Parameters
Product Features
Application Areas
Product Parameters
CGP
| Product type | Product model | Capacity | NAND | DRAM | Encapsulation mode | Temperature (℃) |
| MCP | RSMP0408AALV4A-46BT | 4+8 | 8Gb | 4Gb LPDDR4/4X | FBGA 149-ball | -25 ~ 85 |
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Product Features
Subsize
Packaging multiple chips in a compact package reduces the size of the device
Reliability
Improve chip stability and durability
High performance
LPDDR4X speeds up to 4266Mbps
Low power consumption
Optimize energy distribution between chips to reduce overall power consumption
Application Areas
